Session Information
14th Annual Green Chemistry and Engineering Conference
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Environmentally benign cleaning solutions for wet-based semiconductor processes
Track : June 22, 2010
Program Code: 201
Date: Tuesday, June 22, 2010
Time: 9:20 AM to 9:40 AM  EST
Location: Capital Hilton - Federal A
CONTRIBUTOR (S):
Michael B Korzenski, Advanced Technology Development Division, Advanced Technology Materials, Inc., Danbury, CT, United States
Bauke Jansen, ASML Netherlands B.V., Veldhoven, Netherlands Antilles
Kornel Hoekerd, ASML Netherlands B.V., Veldhoven, Netherlands Antilles
Rebecca Mih, Intermolecular Inc., San Jose, CA, United States
George Mirth, Intermolecular Inc., San Jose, CA, United States
Kim vanBerkel, Intermolecular Inc., San Jose, CA, United States
Todd Hogan, Advanced Technology Development Division, Advanced Technology Materials, Inc., Danbury, CT, United States
Peng Zhang, Advanced Technology Development Division, Advanced Technology Materials, Inc., Danbury, CT, United States
Steve Bilodeau, Advanced Technology Development Division, Advanced Technology Materials, Inc., Danbury, CT, United States
SPEAKER :
Tianniu Chen, Advanced Technology Development Division, Advanced Technology Materials, Inc., Danbury, CT, United States
Description
The exponentially increasing capabilities of the microelectronic devices driven by “Moore’s law” have promoted a global semiconductor industry with a substantial economic scale and a high rate of growth over the past decades. Unfortunately this growth has resulted in increased use of toxic chemicals and intensive energy and water consumption.
With the aid of high throughput screening tools, we are developing a novel, low odor, and environmentally benign formulation in a wet process for semiconductor applications, which also reduces the usage of ultra pure water as compared to its previous generation. The design concept and surface chemistry of this approach will be presented in detail.


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